Custom High Quality 1-15W/MK Silicone Thermal Pad for electronics industry Laptop Notebook Heatsink

Naikos thermal gap pad have excellent insulation and compressibility, be used to fill the air gap between the heating transfer, heat sink and the metal base,  it has good heat transfer capacity between the heat dissipation device and the cooling components.
Thermal gap pad with properties of soft and flexible, low hardness, and the function of damping, and sealing, which make it easy to use and widely used in many fields, like uneven surface, electrical insulation, and electronic components. wide range of thickness can achieve the design requirements of equipment miniaturization and ultra-thin, making it come to be a kind of product with practicability and technicality.

 

1. As to thermal conductivity,Nikos thermal gap pad have the range from 1W/MK to 15W/MK, and the thermal conductivity can be customized as your request to make the best work efficiency.
2.Naikos thermal gap pad standard size is 200mm*400mm, any other size could be customized, no matter it is regular or irregular shape, all could be die cut from the standard sheet into pieces as you request.
3. Thickness is from 0.3mm to 10mm, 0.5/1/1.5/2.0/3.0mm is chosen by most customers.

Naikos will make the recommendation as to your application accordingly. The different applications will request different thermal conductivity, different sizes, also different thicknesses.

 

 

 

1. It is the best thermal pad for laptops, GPU, PCB, SSD, PDP, LCD, and PC.

2. LED lighting, Led TV
3. DRAM memory module
4. Automobile engine control device
5. Heat Pipe assemblies
6. Semiconductor automatic test equipment
7. Communication hardware equipment, Routers
8.IC, CPU, COP, Capacitance, MOS, Power Supply Module,
9.Server, Player, Mobile Phone.

10. Cooling Components to the Chassis, Frame, or other type of heat spreader, etc.