Suministro A Granel De Doble Cara Cinta Adhesiva Térmicamente Conductiva Para Disipador De Calor Chip De Luz LED

Característica

• Rápida disipación del calor
• Ideal para aplicaciones de unión delgada
• Alta resistencia mecánica
• Fácil de montar
• Libre de halógeno
• Gran fiabilidad

Detalles

Naikos Thermal Adhesive Tape is made of advanced thermal conductive PSA, It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, and it is also a great material for filling up the uneven surface between the heat source and heat sink, transferring the heat to the heat sink finally, achieving heat dissipation and lower the product’s temperature.

Naikos Thermal Adhesive Tape provides a good thermal bridge for heat-generating components and heat sinks (such as heat sinks, temperature plates, heat pipes, etc.). It has a high degree of double-sided adhesiveness. You don’t have to be afraid of falling during use. It is economical,The cost is also an absolute advantage.

Naikos Thermal Adhesive Tape can be equivalent to 3m thermal tape type 3m 8805, 3m 8810, 3m 8815, 3m 8820. with the excellent thermal conductivity of 1.2W/mk, makes it widely used for IC, COP, CPU, GPU, MOS and heat sink.

El tamaño personalizado está disponible

El tamaño personalizado está disponible, Naikos podría producirlo según lo soliciten nuestros clientes.

The thickness which is used by most customers are 0.1mm, 0.15mm, 0.2mm,0.25mm, it up to your application, and then choose the most suitable thickness to create the excellent work performance. So the thickness can also be customized up to our customers’ requirements.Rectangular, punching, and coil materials can all meet customer needs.

Solicitud

1. Thermal Adhesive Tape for Heatsink Thermal Interface Attachment‎, Battery Thermal Management‎, LED Lighting Thermal Management‎‎,  Thermal Interface Damping Cushioning.
2. Para cualquier semiconductor de consumo de energía.
3. Fijación del disipador de calor en la placa de circuito de suministro de energía, chips empaquetados y placa de circuito de control del vehículo.