Global Wholesale Custom 1-15W/MK almohadilla conductora térmica para disipador de calor Heat pipe assemblies

Naikos thermal sil pad have excellent insulation and compressibility, be used to fill the air gap between the heating transfer, heat sink and the metal base,  it has good heat transfer capacity between the heat dissipation device and the cooling components.
Thermal sil pad with properties of soft and flexible, low hardness, and the function of damping, and sealing, which make it easy to use and widely used in many fields, like uneven surface, electrical insulation, and electronic components. wide range of thickness can achieve the design requirements of equipment miniaturization and ultra-thin, making it come to be a kind of product with practicability and technicality.

 

1. As to thermal conductivity,Naikos thermal gap pad have the range from 1W/MK to 15W/MK, and the thermal conductivity can be customized as your request to make the best work efficiency.
2.Naikos thermal sil pad standard size is 200mm*400mm, any other size could be customized, no matter it is regular or irregular shape, all could be die cut from the standard sheet into pieces as you request.
3.Naikos thermal pads thickness is from 0.3mm to 10mm, 0.5mm, 1mm, 1.5mm, 2mm, and 3mm is chosen by most customers.

Naikos hará la recomendación en cuanto a su aplicación en consecuencia. Las diferentes aplicaciones requerirán diferentes conductividades térmicas, diferentes tamaños, también diferentes espesores.

 

 

 

1. Es la mejor almohadilla térmica para SSD, portátiles, GPU, PCB, PDP, LCD, and PC.

2. Iluminación LED, TV LED
3. Módulo de memoria DRAM
4. Dispositivo de control de motor de automóvil
5. Conjuntos de tubos de calor
6. Equipo de prueba automático de semiconductores
7. Equipos de hardware de comunicaciones, enrutadores
8. IC, CPU, COP, capacitancia, MOS, módulo de fuente de alimentación,
9.Servidor, reproductor, teléfono móvil.

10. Componentes de refrigeración del chasis, estructura u otro tipo de disipador de calor, etc.