Die-cuting Double Glass Fabric Sided Thermal Conductive Tape For LED Light Chip Heatsink

Ideal for thin bonding applications
High mechanical strength
Easy to assemble
Halogen free
Great reliability

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2 Thermally Conductive Adhesive Tape For Heat Sinks

Thermal Adhesive Tape

The double sided fiberglass thermal conductive tape (also calld heat sink tape,thermal transfer tape) are made of advanced thermal conductive PSA, It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, and it is also a great material for fill up the uneven surface between the heat source and heat sink ,transfer the heat to the heat sink finally, achieve heat dissipation and lower the product’s temperature.Thermal tape provides a good thermal bridge for heat-generating components and heat sinks (such as heat sinks, temperature plates, heat pipes, etc.). It has a high degree of double-sided adhesiveness. You don’t have to be afraid of falling during use. The cost is also an absolute advantage. NKS series thermal tape can equivalent to 3m thermal tape-model 3m 8805, 3m 8810, 3m 8815, 3m 8820. with the excellent thermal conductivity of 1.2W/mk, makes it widely used for IC, COP, CPU, GPU, MOS and heat sink. As to the size of the thermal tape, 5/8/10/15/20/25/30mm at width is popular in our most customers, and length at 25/50m is choosed by many customers. Also other size is available, we could produce it as our customers’ request. The thickness which is used by most customers are0.1/0.15/0.2/0.25/0.3mm, it up to your application, and then choose the most suitable thickness to create the excellent work performance. So the thickness can also be customized up to our customers’ requirements.Rectangular, punching, and coil materials can all meet customer needs.

Thermally Conductive Adhesive Tape For Heat Sinks

1. Heatsink Thermal Interface Attachment‎, Battery Thermal Management‎, LED Lighting Thermal Management‎‎, Thermal Interface Damping Cushioning.2. For any power consumption semiconductor.3. Fixing heat sink on the power supply circuit board, packaged chips and vehicle control circuit board.